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GlasSolderTM process

   Gould Fiber Optics has developed a glass solder process (US Patent numbers 5,500,917 and 5,682,453) for making a glass to glass bond between optical fibers and silica substrate. The patented technique produces a uniform "solder" bead that affixes the fiber to the substrate to provide exceptional mechanical and environmental stability. This bond is much stronger than epoxy and is not susceptible to degradation from humidity. The significance of this packaging improvement is evident in High Temperature Oil & Gas Down-Hole and outside plant applications where long term reliability requirements are stringent.

GlasSolder Fiber Optic Packaging
Features
  • Used as an epoxy replacement
  • CTE matched to silica (and other materials)
  • Inert
  • Does not absorb water
  • Rigid
  • Used as a hermetic fiber seal
  • No metallization required-two step process.
Applications
  • Optoelectronics packaging
  • Connector Fabrication
  • Fiber Pigtailing
  • Fiber Collimating Assemblies
  • Hermetic Seals

Benefits of GlasSolderTM package No Epoxy
  • Glass-to-glass bond between optical fibers and quartz substrate
  • Stronger bond than epoxy
  • No out-gassing
  • Not susceptible to humidity/heat degradation
  • Impervious to moisture, humidity and temperature
  • Long-term reliability designed to comply with Telcordia GR-1209/GR-1221
  • Withstands high optical powers without degradation

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