Gould Fiber Optics developed a GlasSolder® process (U.S Patent numbers 5,500,917 and 5,682,453) for making a glass-to-glass bond between optical fibers and a silica substrate. This bond is much stronger than epoxy and is not susceptibile to degradation from humidity.
GlasSolder® is applied to silica substrate, providing a glass to glass bond of the optical fibers and the substrate. This bond is much stronger than epoxy and is not susceptible to degradation from humidity.
The addition of the GlasSolder® eliminates the epoxy as the primary bonding mechanism and greatly improves performance and long term reliability.
Features
- Used as an epoxy replacement
- CTE matched to silica
(and other materials)
- Inert
- Does not absorb water
- Rigid
- Used as a hermetic fiber seal
- No metallization required-two step process.
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Benefits of GlasSolder® package
- No Epoxy
- Glass-to-glass bond between optical fibers and quartz substrate
- Stronger bond than epoxy
- No out-gassing
- Not susceptible to humidity/heat degradation
- Impervious to moisture, humidity and temperature
- Long-term reliability designed to comply with Telcordia GR-1209/GR-1221
- Withstands high optical powers without degradation
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Applications
- Optoelectronics packaging
- Connector Fabrication
- Fiber Pigtailing
- Fiber Collimating Assemblies
- Hermetic Seals
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